中文 English
Hotline:0755-28364930 
  Product list
 
  Product search
  Contact us

Shenzhen Bonyx Electronics Co.,Ltd

Tel: 0086-0755-28364930

0086-0755-28609509/28602015

Fax:0086-0755-28449151

Mobile:0086-013418605154 

Skype:jondy.wang

MSN:dsx886@live.cn

Add:The 2th floor.Town 19-1.AnYe Road  8th An Lian village HengGang Town.LongGang District,ShenZhen,P.R.China

  Products
HC910导热硅胶
name:Thermal silica gel
Type:Thermal conductive silicone
Model:HC910导热胶
>>Back
 Introduction:
一.Products detail
This product is a unit of room temperature neutral curing glue, specialized in electronic components of the flame retardant fixed, good ageing resistance, high low temperature (- 60 ~ + 200 DHS C), moisture properties. For a variety of metal materials, plastic no corrosion, thermal conductive performance is good, and have excellent adhesion, flame retardant level is UL94V - 0 level. Colloid appearance is exquisite, the glue smooth, not wiredrawing, has the good performance, easy to manual and machine sizing, widely used in electronic products in capacitance, coil components flame retardant fixed.
二:Technical parameters
state
Inspection item
Products testing results
Before
curing
appearance
 White fine paste
proportion(g/cm3
1.50±0.02
Surface dry time(25ºC,RH:50±5%,min)
2~15 hours
 
 
 
After
curing
hardness(Shore A)
55~65
Tensile strength(MPa)
1.7
Condutcivity factor(w/m·k)
1.7
Alongation (%)
≥50
Shear strength(Mpa-)
≥1.5
Volume  resistivity(ohm-cm)
1.2×1014
compression strength(Kv/mm)
18
 flame retardant rating
UL94V-0
Note:The above products after curing data are for temperature 25 º C, relative humidity 50-5% of the conditions, curing 7 days after the test
二.Method of used
 1. The base material cleaning: dispel and washing any may affect the material performance of pollutant, clean and dry.
2. Sizing: can be manual or use dispensing equipment, the glue coating to the corresponding base material of sizing parts can be.
3. Cure: the product is moisture curing materials, the table dry and curing speed depends on the material use environmental relative humidity and temperature
Degree and the thickness of the glue.
4. Table dry cure time: in 25 º C, RH: 50% of the conditions, dry time table for 2 ~ 15 min, 2 mm thick coating preliminary
Curing time is about 24 hours, 7 days to achieve the best design performance.
 
Purpose:
Suitable for general electronic components without corrosion flame retardant bonding, fixed.
Four. Packaging, storage and transportation and shelf life
1. Packing: 300 ml/branch, 2.6 L/barrel
2. Storage and transportation: this product is non-toxic non-dangerous goods, according to the general chemical handling, stored in a cool and dry place (room temperature).
3. Shelf life: six months (23 º C below).
Five. Safety operating instructions
The safe use of instructions in the list, the operation before please read the product MSDS, but from the company and the distributors obtain.
Six. Caveat
The company provides product description information is based on our understanding of the performance of this product for the user to provide a reference, but each user product has its own characteristics. Therefore, please all users in the use of this product must be carried out before the necessary and the comprehensive test to determine the suitability of this product, thank you!
 
Friends links:
Home       About us       jobs       Products       News       Join us       Sales network       Feedback       Contact us
Shenzhen BoLen yongxin electronic Co., LTD   

Add:The 2th floor.Town 19-1.AnYe Road  8th An Lian village HengGang Town.LongGang District,ShenZhen,P.R.China

Tel: 86-0755-28364930 86-0755-28609509   86-13418605154  Fax:86-0755-28449151   E-mail:kevinchenmin@163.com    Skype:jondy.wang
  技术支持:出格软件  粤ICP备11093307号